Method of electrically contacting a bond pad of a device under test with a probe
US10267848B2 · kind B2 · utility
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859References
11Claims
0Family size
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Inventor
Key dates
| Filing date | Jul 28, 2016 |
| Grant date | Apr 23, 2019 |
| Priority date | — |
| Expiry date | Jul 28, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49208
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The contacts of a probing apparatus are elastically supported on a replaceable coupon and electrically interconnected with conductors on a membrane or a space transformer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.