Method of inspecting semiconductor wafer, an inspection system for performing the same, and a method of fabricating semiconductor device using the same
US10269111B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 17, 2017 |
| Grant date | Apr 23, 2019 |
| Priority date | — |
| Expiry date | May 24, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of inspecting a semiconductor wafer is provided, the method includes scanning a plurality of inspection swaths on a wafer to obtain a plurality of image sets and producing a plurality of reference images from the plurality of image sets, respectively. The method of inspecting a semiconductor wafer further includes selecting a plurality of target images from the plurality of image sets, respectively. The method of inspecting a semiconductor wafer additionally includes comparing each reference image of the plurality of reference images with each target image of the plurality of target images to detect a defect image from each of the plurality of target images. A reference image being compared and a target image being compared are images scanned from the same inspection swath.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.