Method of manufacturing a release film as isolation film in package
US10269589B2 · kind B2 · utility
3Cited by
12References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2017 |
| Grant date | Apr 23, 2019 |
| Priority date | — |
| Expiry date | Sep 6, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method includes forming a release film over a carrier, forming a metal post on the release film, encapsulating the metal post in an encapsulating material, performing a planarization on the encapsulating material to expose the metal post, forming a redistribution structure over the encapsulating material and the metal post, decomposing a first portion of the release film to separate a second portion of the release film from the carrier, and forming an opening in the release film to expose the metal post.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.