Method and apparatus for bonding semiconductor devices
US10269611B1 · kind B1 · utility
4Cited by
0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2018 |
| Grant date | Apr 23, 2019 |
| Priority date | — |
| Expiry date | Mar 19, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68327
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for bonding semiconductor devices are disclosed. In an embodiment, the method may include attaching a first die to a flip head of a flip module, flipping the first die with the flip module, removing the first die from the flip module after flipping the first die, inspecting the flip head of the flip module for contamination after removing the first die, cleaning the flip head with an in situ cleaning module after inspecting the flip head, and attaching a second die to the flip head after cleaning the flip head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.