Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices
US10269682B2 · kind B2 · utility
8Cited by
47References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2015 |
| Grant date | Apr 23, 2019 |
| Priority date | — |
| Expiry date | Jan 28, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices are disclosed. In some embodiments, a cooling device for a semiconductor device includes a reservoir having a first plate and a second plate coupled to the first plate. A cavity is between the first plate and the second plate. A phase change material (PCM) is in the cavity. The cooling device is adapted to dissipate heat from a packaged semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.