Inventor · Zhubeikou, TW

Wensen Hung

71Patents
12h-index
30Co-inventors
80Inventor score

Filing activity: Dec 30, 2010 → Feb 6, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US9076754B2 3DIC packages with heat sinks attached to heat dissipating rings Electricity 24 Active
US9224673B2 Packages for semiconductor devices, packaged semiconductor devices, and methods of cooling packaged semiconductor devices Emerging Cross-Sectional Technologies 22 Active
US9583415B2 Packages with thermal interface material on the sidewalls of stacked dies Electricity 21 Active
US9780072B2 3D semiconductor package interposer with die cavity Electricity 20 Active
US9269694B2 Packages with thermal management features for reduced thermal crosstalk and methods of forming same Electricity 16 Active
US9595506B2 Packages with thermal management features for reduced thermal crosstalk and methods of forming same Electricity 16 Active
US9287194B2 Packaging devices and methods for semiconductor devices Electricity 16 Active
US9385095B2 3D semiconductor package interposer with die cavity Electricity 15 Active
US10332823B2 Packaged semiconductor devices Emerging Cross-Sectional Technologies 14 Active
US10157818B2 Methods of cooling packaged semiconductor devices Emerging Cross-Sectional Technologies 14 Active
US10461009B2 3DIC packaging with hot spot thermal management features Electricity 14 Active
US9082743B2 3DIC packages with heat dissipation structures Electricity 14 Active
US10062665B2 Semiconductor packages with thermal management features for reduced thermal crosstalk Electricity 11 Active
US8878560B2 High frequency probing structure Emerging Cross-Sectional Technologies 10 Active
US9735082B2 3DIC packaging with hot spot thermal management features Electricity 9 Active
US10269682B2 Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices Electricity 8 Active
US10867885B2 Heat spreading device and method Electricity 7 Active
US10461014B2 Heat spreading device and method Electricity 7 Active
US9941251B2 3DIC packages with heat dissipation structures Electricity 6 Active
US8723538B2 Probe head formation methods employing guide plate raising assembly mechanism Physics 6 Active
US8832933B2 Method of fabricating a semiconductor test probe head Emerging Cross-Sectional Technologies 5 Active
US9576938B2 3DIC packages with heat dissipation structures Electricity 4 Active
US10157813B2 3DIC packaging with hot spot thermal management features Electricity 4 Active
US10515867B2 Semiconductor structure and manufacturing method thereof Electricity 4 Active
US11062971B2 Package structure and method and equipment for forming the same Electricity 4 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.