Advanced thermally compensated surface acoustic wave device and fabrication
US10270413B2 · kind B2 · utility
0Cited by
1References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2014 |
| Grant date | Apr 23, 2019 |
| Priority date | — |
| Expiry date | Nov 29, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/25
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
This disclosure relates to a method of fabrication of a surface acoustic wave device comprising the step (a) of providing a piezoelectric structure, the step (b) of providing a dielectric structure, wherein the step (b) comprises a step (b1) of metalizing the dielectric structure, and the method further comprising the step (c) of bonding the metalized dielectric structure to the piezoelectric structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.