Patent assignee · FR · COMPANY

SOITEC

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499Patents
496Active
499Granted
61Portfolio score

Filing activity: Sep 7, 2000 → Jun 26, 2024 · 103 expiring within 5 years

Most-cited patents

PatentTitleAreaCited byStatus
US9224704B2 Process for realizing a connecting structure Electricity 200 Active
US8501537B2 Methods for bonding semiconductor structures involving annealing processes, and bonded semiconductor structures formed using such methods Electricity 200 Active
US8697493B2 Bonding surfaces for direct bonding of semiconductor structures Electricity 200 Active
US8716105B2 Methods for bonding semiconductor structures involving annealing processes, and bonded semiconductor structures and intermediate structures formed using such methods Electricity 197 Active
US8314007B2 Process for fabricating a heterostructure with minimized stress Electricity 128 Active
US8859337B2 Thermal matching in semiconductor devices using heat distribution structures Electricity 34 Active
US8305803B2 DRAM memory cell having a vertical bipolar injector Physics 25 Active
US8575002B2 Direct bonding method with reduction in overlay misalignment Emerging Cross-Sectional Technologies 23 Active
US7208392B1 Creation of an electrically conducting bonding between two semi-conductor elements Electricity 22 Expired
US8461017B2 Methods of forming bonded semiconductor structures using a temporary carrier having a weakened ion implant region for subsequent separation along the weakened region Electricity 19 Active
US8202785B2 Surface treatment for molecular bonding Electricity 18 Active
US7300853B2 Thin layer semi-conductor structure comprising a heat distribution layer Electricity 18 Expired
US8475612B2 Method for molecular adhesion bonding with compensation for radial misalignment Emerging Cross-Sectional Technologies 17 Active
US8299485B2 Substrates for monolithic optical circuits and electronic circuits Electricity 16 Active
US8367520B2 Methods and structures for altering strain in III-nitride materials Electricity 13 Active
US9209301B1 Method for fabricating semiconductor layers including transistor channels having different strain states, and related semiconductor layers Electricity 11 Active
US8679944B2 Progressive trimming method Electricity 11 Active
US8575697B2 SRAM-type memory cell Electricity 10 Active
US8673733B2 Methods of transferring layers of material in 3D integration processes and related structures and devices Electricity 10 Active
US8842945B2 Methods of forming three dimensionally integrated semiconductor systems including photoactive devices and semiconductor-on-insulator substrates Electricity 9 Active
US8505197B2 Methods of fabricating multilayer substrates Emerging Cross-Sectional Technologies 9 Active
US8866305B2 Methods of forming bonded semiconductor structures Electricity 9 Active
US8388755B2 Thermalization of gaseous precursors in CVD reactors Chemistry; Metallurgy 9 Active
US8471243B1 Photoactive devices with improved distribution of charge carriers, and methods of forming same Emerging Cross-Sectional Technologies 9 Active
US8163570B2 Method of initiating molecular bonding Electricity 9 Active

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.