Solder alloy, and LED module
US10272527B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 2, 2015 |
| Grant date | Apr 30, 2019 |
| Priority date | — |
| Expiry date | Jul 12, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12041
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Provided is a solder alloy having a composition suitable for soldering a module obtained by joining an aluminum substrate to a component wherein a main body, in which the area of an electrode on a side surface is not more than 30% of the total area of the side surface, is comprised of a ceramic. The solder alloy has an alloy composition comprising, in terms of mass %, 3-10% of Sb, 0-4% of Ag and 0.3-1.2% of Cu, with the remainder consisting of Sn. Furthermore, the alloy composition may contain, in terms of mass %, a total of 0.15% or less of one or more elements selected from among Ni and Co and/or a total of 0.02% or less of one or more elements selected from among P and Ge.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.