Polishing layer analyzer and method

US10272541B2 · kind B2 · utility

Assignees

• Rohm and Haas Electronic Materials CMP Holdings, Inc. · US
• DOW GLOBAL TECHNOLOGIES LLC · US

Inventors

• Scott Chang · Taipei, TW
• Jeff Tsai · Zhunan Town, TW
• Francis V. Acholla · Yardley, US
• Andrew Wank · Avondale, US
• Mark Gazze · McKeesport, US
• William A. Heeschen · Midland, US
• James D. Tate · Lake Jackson, US
• Leo H. Chiang · Pearland, US
• Swee-Teng Chin · Pearland, US

Key dates

• Filing date: Jan 22, 2016
• Grant date: Apr 30, 2019
• Expiry date: Aug 2, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/7684
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A polishing layer analyzer is provided, wherein the analyzer is configured to detect macro inhomogeneities is polymeric sheets and to classify the polymeric sheets as either acceptable or suspect.