Interconnect structure with air-gaps
US10276498B2 · kind B2 · utility
2Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2017 |
| Grant date | Apr 30, 2019 |
| Priority date | — |
| Expiry date | Dec 22, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In some embodiments, the present disclosure relates to an interconnect structure. The interconnect structure has a first dielectric layer disposed over a substrate and a conductive structure arranged within the first dielectric layer. An air-gap separates sidewalls of the conductive structure from the first dielectric layer. The air-gap continuously extends from a first side of the conductive structure to an opposing second side of the conductive structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.