Inventor · Hsinchu, TW

Tai-I Yang

87Patents
5h-index
57Co-inventors
71Inventor score

Filing activity: Jun 1, 2012 → Jul 26, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US9390965B2 Air-gap forming techniques for interconnect structures Electricity 10 Active
US9716035B2 Combination interconnect structure and methods of forming same Electricity 6 Active
US9269609B2 Semiconductor isolation structure with air gaps in deep trenches Electricity 6 Active
US9837354B2 Hybrid copper structure for advance interconnect usage Electricity 5 Active
US10290580B2 Hybrid copper structure for advance interconnect usage Electricity 5 Active
US9735232B2 Method for manufacturing a semiconductor structure having a trench with high aspect ratio Electricity 3 Active
US11088020B2 Structure and formation method of interconnection structure of semiconductor device Electricity 3 Active
US9576896B2 Semiconductor arrangement and formation thereof Electricity 2 Active
US10049941B2 Semiconductor isolation structure with air gaps in deep trenches Electricity 2 Active
US10534273B2 Multi-metal fill with self-aligned patterning and dielectric with voids Electricity 2 Active
US10991618B2 Semiconductor device and method of manufacture Electricity 2 Active
US9559134B2 Deep trench spacing isolation for complementary metal-oxide-semiconductor (CMOS) image sensors Electricity 2 Active
US10026647B2 Multi-metal fill with self-align patterning Electricity 2 Active
US10276498B2 Interconnect structure with air-gaps Electricity 2 Active
US10177242B2 Semiconductor arrangement and formation thereof Electricity 2 Active
US11004740B2 Structure and method for interconnection with self-alignment Electricity 2 Active
US10714421B2 Structure and formation method of semiconductor device with self-aligned conductive features Electricity 2 Active
US10930551B2 Methods for fabricating a low-resistance interconnect Electricity 2 Active
US10676351B2 Nano-electromechanical system (NEMS) device structure and method for forming the same Performing Operations; Transporting 2 Active
US9583434B2 Metal line structure and method Electricity 2 Active
US9698242B2 Semiconductor arrangement and formation thereof Electricity 2 Active
US10340181B2 Interconnect structure including air gap Electricity 2 Active
US10000373B2 Nano-electromechanical system (NEMS) device structure and method for forming the same Performing Operations; Transporting 1 Active
US9633897B2 Air-gap forming techniques for interconnect structures Electricity 1 Active
US9875967B2 Interconnect structure with air-gaps Electricity 1 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.