Semiconductor packages and methods of forming the same
US10276508B2 · kind B2 · utility
2Cited by
14References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2017 |
| Grant date | Apr 30, 2019 |
| Priority date | — |
| Expiry date | Sep 28, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor packages and methods of forming the same are disclosed. The semiconductor package includes a plurality of chips, a first molding compound, a first redistribution structure, a second molding compound and a second redistribution structure. The first molding compound encapsulates the chips. The first redistribution structure is disposed over the plurality of chips and the first molding compound. The second molding compound surrounds the first molding compound. The second redistribution structure is disposed over the first redistribution structure, the first molding compound and the second molding compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.