Inventor · Houliao, TW

Chi-Yang Yu

42Patents
3h-index
21Co-inventors
55Inventor score

Filing activity: Aug 27, 2014 → Aug 9, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US10157871B1 Integrated fan-out package and manufacturing method thereof Electricity 13 Active
US9865566B1 Semiconductor structure and manufacturing method thereof Electricity 7 Active
US10141201B2 Integrated circuit packages and methods of forming same Electricity 3 Active
US11244879B2 Semiconductor package Electricity 3 Active
US9812410B2 Lid structure for a semiconductor device package and method for forming the same Electricity 3 Active
US10790210B2 Semiconductor package and manufacturing method thereof Electricity 2 Active
US10522436B2 Planarization of semiconductor packages and structures resulting therefrom Electricity 2 Active
US10957672B2 Package structure and method of manufacturing the same Electricity 2 Active
US10276508B2 Semiconductor packages and methods of forming the same Electricity 2 Active
US11145639B2 Semiconductor package and manufacturing method thereof Electricity 2 Active
US11127644B2 Planarization of semiconductor packages and structures resulting therefrom Electricity 1 Active
US9666556B2 Flip chip packaging Electricity 1 Active
US11424220B2 Semiconductor structure and manufacturing method thereof Electricity 1 Active
US9941186B2 Method for manufacturing semiconductor structure Electricity 1 Active
US11315862B2 Semiconductor structure and manufacturing method thereof Electricity 1 Active
US11705408B2 Semiconductor package Electricity 1 Active
US10157863B2 Method for forming a lid structure for a semiconductor device package Electricity 1 Active
US10804245B2 Semiconductor structure and manufacturing method thereof Electricity 1 Active
US10700031B2 Integrated fan-out package and manufacturing method thereof Electricity 1 Active
US11824032B2 Die corner removal for underfill crack suppression in semiconductor die packaging Electricity 0 Active
US12412862B2 Package structure and manufacturing method thereof Electricity 0 Active
US12165946B2 Semiconductor package and manufacturing method thereof Electricity 0 Active
US11264304B2 Semiconductor structure and associated method for manufacturing the same Electricity 0 Active
US10622278B2 Semiconductor structure and associated method for manufacturing the same Electricity 0 Active
US11355461B2 Integrated fan-out package and manufacturing method thereof Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.