Semiconductor device having a boundary structure, a package on package structure, and a method of making
US10276531B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 16, 2017 |
| Grant date | Apr 30, 2019 |
| Priority date | — |
| Expiry date | May 31, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3841
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to a semiconductor device. In some embodiments, the semiconductor device has a first plurality of conductive pads arranged over a first substrate. A conductive solder material is arranged over and is electrically connected to the first plurality of conductive pads. A first boundary structure separates each conductive pad of the first plurality of conductive pads from an adjacent conductive pad of the first plurality of conductive pads. A die is arranged over the first substrate. The die has outermost sidewalls that are laterally separated from first and second ones of the first plurality of conductive pads by the first boundary structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.