Method for orienting solder balls on a BGA device
US10278292B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2016 |
| Grant date | Apr 30, 2019 |
| Priority date | — |
| Expiry date | Apr 6, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49149
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A BGA structure having larger solder balls in high stress regions of the array is disclosed. The larger solder balls have higher solder joint reliability (SJR) and as such may be designated critical to function (CTF), whereby the larger solder balls in high stress regions carry input/output signals between a circuit board and a package mounted thereon. The larger solder balls are accommodated by recessing each ball in the package substrate, the circuit board, or both the package substrate and the circuit board. Additionally, a ball attach method for mounting a plurality of solder balls having different average diameters is disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.