Scott Gilbert
13Patents
3h-index
9Co-inventors
49Inventor score
Filing activity: Jul 29, 2003 → Feb 26, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7253523B2 | Reworkable thermal interface material | Electricity | 16 | Expired |
| US9293426B2 | Land side and die side cavities to reduce package Z-height | Emerging Cross-Sectional Technologies | 10 | Active |
| US7241147B2 | Making electrical connections between a circuit board and an integrated circuit | Electricity | 3 | Expired |
| US9799556B2 | Land side and die side cavities to reduce package z-height | Emerging Cross-Sectional Technologies | 2 | Active |
| US9721882B2 | Land side and die side cavities to reduce package z-height | Emerging Cross-Sectional Technologies | 2 | Active |
| US10297542B2 | Land side and die side cavities to reduce package z-height | Emerging Cross-Sectional Technologies | 2 | Active |
| US7098534B2 | Sacrificial component | Emerging Cross-Sectional Technologies | 1 | Expired |
| US11528809B2 | Method for orienting solder balls on a BGA device | Emerging Cross-Sectional Technologies | 0 | Active |
| US11538753B2 | Electronic chip with under-side power block | Electricity | 0 | Active |
| US10278292B2 | Method for orienting solder balls on a BGA device | Emerging Cross-Sectional Technologies | 0 | Active |
| US10950537B2 | Land side and die side cavities to reduce package z-height | Emerging Cross-Sectional Technologies | 0 | Active |
| US9237659B2 | BGA structure using CTF balls in high stress regions | Emerging Cross-Sectional Technologies | 0 | Active |
| US10980134B2 | Method for orienting solder balls on a BGA device | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.