Method of assembling an electronic component using a probe having a fluid thereon
US10278318B2 · kind B2 · utility
0Cited by
7References
16Claims
0Family size
Assignee
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Key dates
| Filing date | Dec 18, 2015 |
| Grant date | Apr 30, 2019 |
| Priority date | — |
| Expiry date | Mar 18, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0408
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of assembly comprising providing an assembly probe, the assembly probe having an end coupling face; providing a droplet of fluid on the end coupling face of the assembly probe; coupling an electronic component to the end coupling face of the assembly probe with the fluid droplet, the electronic component having a peripheral dimension equal to or less than 2 mm in each of length, width and height; placing the electronic component on a substrate with the assembly probe; decoupling the electronic component from the end coupling face of the assembly probe; and assembling the electronic component to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.