Kyle Yazzie
13Patents
1h-index
42Co-inventors
46Inventor score
Filing activity: Nov 24, 2015 → Feb 10, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9661745B1 | Vacuum lamination of depth-sensing camera module PCB to stiffener using built-in vacuum channels | Electricity | 4 | Active |
| US11327050B2 | Mechanical failure monitoring, detection, and classification in electronic assemblies | Physics | 1 | Active |
| US10957656B2 | Integrated circuit packages with patterned protective material | Electricity | 1 | Active |
| US10290569B2 | Constrained cure component attach process for improved IC package warpage control | Electricity | 1 | Active |
| US11322456B2 | Die back side structures for warpage control | Electricity | 0 | Active |
| US12327801B2 | Robust mold integrated substrate | Electricity | 0 | Active |
| US10049987B2 | Enhanced fiducial visibility and recognition | Electricity | 0 | Active |
| US10499461B2 | Thermal head with a thermal barrier for integrated circuit die processing | Physics | 0 | Active |
| US11022792B2 | Coupling a magnet with a MEMS device | Performing Operations; Transporting | 0 | Active |
| US10998275B2 | Package with cathodic protection for corrosion mitigation | Electricity | 0 | Active |
| US10278318B2 | Method of assembling an electronic component using a probe having a fluid thereon | Electricity | 0 | Active |
| US10985080B2 | Electronic package that includes lamination layer | Electricity | 0 | Active |
| US11322455B2 | Robust mold integrated substrate | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.