Adhesive resin composition, adhesive film, and flexible metal laminate
US10280343B2 · kind B2 · utility
0Cited by
6References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2015 |
| Grant date | May 7, 2019 |
| Priority date | — |
| Expiry date | Dec 8, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0154
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to an adhesive resin composition including a styrene-ethylene-butylene-styrene copolymer with a specific chemical structure, an epoxy resin, an acid anhydride compound, and a curing catalyst, an adhesive film obtained from the resin composition, and a flexible metal laminate including the adhesive film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.