Roughened copper foil, copper clad laminate, and printed circuit board
US10280501B2 · kind B2 · utility
0Cited by
2References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 6, 2016 |
| Grant date | May 7, 2019 |
| Priority date | — |
| Expiry date | Apr 6, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1259
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
There is provided a roughened copper foil which can significantly improve adhesion to an insulating resin and reliability (e.g., hygroscopic heat resistance). The roughened copper foil of the present invention has at least one roughened surface having fine irregularities composed of acicular crystals, wherein the entire surface of the acicular crystals is composed of a mixed phase of Cu metal and Cu2O.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.