Hiroaki Tsuyoshi
4Patents
2h-index
8Co-inventors
41Inventor score
Filing activity: May 1, 1996 → Apr 6, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6165617A | Resin-coated copper foil for multilayer printed wiring board and multilayer printed wiring board provided with said copper foil | Emerging Cross-Sectional Technologies | 7 | Expired |
| US5800722A | Multilayer printed wiring board and process for manufacturing the same | Electricity | 6 | Expired |
| US9338898B2 | Method of producing a printed wiring board | Emerging Cross-Sectional Technologies | 0 | Active |
| US10280501B2 | Roughened copper foil, copper clad laminate, and printed circuit board | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.