Probe card for testing semiconductor wafers
US10281491B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2016 |
| Grant date | May 7, 2019 |
| Priority date | — |
| Expiry date | Jan 3, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2891
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A probe card is disclosed. The probe card includes a first disc, a second disc, an alignment plate and multiple micro probes. One of the micro probes includes a linear segment and a curved segment connected to each other at an angle stop. The first disc includes a recessed area having multiple holes formed therein, wherein one of the holes is configured to receive the linear segment of the micro probe. The second disc includes a recessed area having multiple holes formed therein, wherein one of the holes is configured to receive the curved segment of the micro probe. Placed within the recessed area of the second disc, the alignment plate includes multiple holes formed therein, wherein one of the holes is configured to receive the curved segment of the micro probe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.