Patent · US Active

Semiconductor chip with fracture detection

US10281517B2 · kind B2 · utility

0Cited by

2References

18Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thomas Zettler · Hersbruck, DE
Dirk Hammerschmidt · Villach, AT
Friedrich Rasbornig · Klagenfurt, AT
Wolfgang Scheibenzuber · Munich, DE
Hans-Joerg Wagner · Villach, AT

Key dates

Filing date	Feb 6, 2017
Grant date	May 7, 2019
Priority date	—
Expiry date	Mar 1, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A semiconductor chip includes a substrate, an integrated circuit, an indentation of the substrate, a conductor track, and also a crossover between the indentation and the conductor track. Detection of a test signal fed into the conductor track is made possible in this way. In various examples, a fracture of the substrate in the region of the indentation can be detected.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.