Patent · US Active

Chip card module, chip card, chip card arrangement, method of forming a chip card module, and method of forming a chip card

US10282655B2 · kind B2 · utility

0Cited by

1References

19Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Frank Pueschner · Kelheim, DE
Siegfried Hoffner · Nesselwang, DE
Jens Pohl · San Luis Obispo, US

Key dates

Filing date	Jul 17, 2017
Grant date	May 7, 2019
Priority date	—
Expiry date	Jul 17, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15321
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A chip card module is provided. The chip card module may include a carrier having a first side and an opposite second side, a chip arranged over the carrier, the chip having a first chip contact, a first and a second antenna contact formed over the first side, a metal-free area formed over the first side between the first antenna contact and the second antenna contact, wherein the metal-free area extends between a first edge portion and a second edge portion of the carrier, and a first chip connection electrically connecting the first chip contact to the first antenna contact, wherein the first chip connection is at least partially arranged over the second side in a region opposite the metal-free area.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.