Wafer carrying fork, semiconductor device manufacturing system, and wafer transporting method
US10283393B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 12, 2018 |
| Grant date | May 7, 2019 |
| Priority date | — |
| Expiry date | Jan 12, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68707
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer carrying fork includes a fork body, a plurality of wafer suction holes, a plurality of gas purging elements, a plurality of gas purging pipes, a plurality of gas suction elements, and a plurality of gas suction pipes. The fork body has a top surface, a bottom surface opposite to the top surface, and a plurality of lateral surfaces connecting the top surface and the bottom surface. The wafer suction holes are located on the top surface of the fork body. The gas purging elements are located on the lateral surfaces of the fork body. The gas purging pipes are connected to the gas purging elements. The gas suction elements are located on the bottom surface of the fork body. The gas suction pipes are connected to the gas suction elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.