Communicating optical signals between stacked dies

US10283490B2 · kind B2 · utility

Assignee

• GlobalFoundries Inc. · KY

Inventors

• Sven Beyer · Dresden, DE
• Jan Hoentschel · Dresden, DE
• Alexander Ebermann · Dresden, DE

Key dates

• Filing date: Sep 22, 2017
• Grant date: May 7, 2019
• Expiry date: Oct 7, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/12044
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method includes forming a stack of semiconductor die. The stack includes a first semiconductor die, a second semiconductor die and a third semiconductor die. The first semiconductor die is stacked above the second semiconductor die and the third semiconductor die is stacked above the first semiconductor die. A first optical transmitter and a first optical receiver are provided in the first semiconductor die, a second optical transmitter is provided in the second semiconductor die, and a second optical receiver is provided in the third semiconductor die. A first optical signal is transmitted from the first optical transmitter in the first semiconductor die to the second optical receiver in the third semiconductor die. A second optical signal is transmitted from the second optical transmitter in the second semiconductor die to the first optical receiver in the first semiconductor die.