Semiconductor device comprising an aperture array and method of producing such a semiconductor device
US10283541B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 9, 2015 |
| Grant date | May 7, 2019 |
| Priority date | — |
| Expiry date | Dec 8, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/811
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A photosensor (2) is arranged in a semiconductor substrate (1) at a main surface (10), a dielectric layer (4) is arranged on or above the main surface, the dielectric layer including a metal layer (6) electrically connected with the photosensor, and an aperture layer (16) formed from an opaque or semitransparent material is arranged on or above the dielectric layer. The aperture layer is provided with an array of transparent aperture zones (18) above the photosensor, each of the aperture zones penetrating the aperture layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.