Laser processing device and laser processing method
US10286485B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2016 |
| Grant date | May 14, 2019 |
| Priority date | — |
| Expiry date | Aug 11, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B27/141
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The laser processing device includes: a measuring device configured to measure a change in a height of an object and including a first light source configured to emit probe light, a first light focusing unit configured to focus the probe light on the object, a light sensing unit configured to detect a change in the probe light reflected from a reflective surface of the object and including a Shack-Hartmann sensor, and a calculation unit configured to calculate the change in the height of the object by using the change in the reflected light detected by the light sensing unit; a second light source configured to emit laser light for processing to the object; and a focus adjusting device configured to adjust a focus of the laser light emitted to the object by using the change in the height of the object to be processed measured by the measuring device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.