EO TECHNICS CO., LTD
25Patents
18Active
25Granted
44Portfolio score
Filing activity: May 6, 2002 → Jan 26, 2024 · 4 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8329560B2 | Laser processing apparatus and method using beam split | Electricity | 11 | Active |
| US6808117B2 | Method and apparatus for calibrating marking position in chip scale marker | Electricity | 10 | Expired |
| US6710286B2 | Chip scale marker and making method | Electricity | 3 | Expired |
| US7164519B2 | Laser processing apparatus and method using polygon mirror | Performing Operations; Transporting | 3 | Expired |
| US6870127B2 | Chip scale marker and marking method | Performing Operations; Transporting | 3 | Expired |
| US10286485B2 | Laser processing device and laser processing method | Physics | 2 | Active |
| US7672344B2 | Multi-laser system | Performing Operations; Transporting | 2 | Active |
| US10861725B2 | Laser marking device and laser marking method | Electricity | 1 | Active |
| US7713780B2 | Method of multi-processing object using polygon mirror | Performing Operations; Transporting | 1 | Active |
| US6794205B2 | Chip scale marker and method of calibrating marking position | Electricity | 1 | Expired |
| US7688492B2 | Laser processing apparatus | Electricity | 1 | Expired |
| US11478828B2 | Adhesive removing device and method | Performing Operations; Transporting | 0 | Active |
| US10867828B2 | Marking position correcting apparatus and method | Electricity | 0 | Active |
| US7126083B2 | Chip scale marker and method of calibrating marking position | Electricity | 0 | Expired |
| US11621184B2 | Laser marking device and laser marking method | Electricity | 0 | Active |
| US7688877B2 | Laser machining apparatus | Performing Operations; Transporting | 0 | Active |
| US12405478B2 | Apparatus for laser annealing and operating method thereof | Electricity | 0 | Active |
| US10770298B2 | Automatic inspection device and method of laser processing equipment | Performing Operations; Transporting | 0 | Active |
| US11065805B2 | Warpage reduction device and warpage reduction method | Electricity | 0 | Active |
| US10304778B2 | Wafer marking method | Electricity | 0 | Active |
| US11158510B2 | Monitoring device, monitoring method and method of manufacturing semiconductor device using reflectivity of wafer | Physics | 0 | Active |
| US10134681B2 | Laser processing method for cutting semiconductor wafer having metal layer formed thereon and laser processing device | Electricity | 0 | Active |
| US12214442B2 | Variable-pulse-width flat-top laser device and operating method therefor | Electricity | 0 | Active |
| US10290525B2 | Marking method for wafer dice | Electricity | 0 | Active |
| US12370625B2 | Variable-pulse-width flat-top laser device and operating method therefor | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.