Imprint apparatus and imprint method
US10290498B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2018 |
| Grant date | May 14, 2019 |
| Priority date | — |
| Expiry date | Mar 12, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/54426
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to an embodiment, a first alignment mark includes a first template-side mark in which a plurality of first portions are arranged with a first period, and a second template-side mark in which a plurality of second portions are arranged with a second period. A second alignment mark includes a first wafer-side mark in which a plurality of third portions are arranged with a third period, and a second wafer-side mark in which a plurality of fourth portions are arranged with a fourth period. The first wafer-side mark and the first template-side mark are configured to be overlaid with each other to constitute a first moire mark. The second wafer-side mark and the second template-side mark are configured to be overlaid with each other to constitute a second moire mark. An average period of the first moire mark and an average period of the second moire mark are different from each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.