Release layer for subsequent manufacture of flexible substrates in microelectronic applications
US10290531B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Apr 29, 2014 |
| Grant date | May 14, 2019 |
| Priority date | — |
| Expiry date | May 5, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68386
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Compositions and methods are described for a release layer that is affixed directly onto a carrier or with the use of an interfacial adhesive layer to fabricate a flexible work product, and upon completion, the release layer is removed by an external applied force of a given value that overcomes the adhesive force without harm to the work product. The release layer serves as a permanent support for the manufacture of flexible electronic devices and upon completion offers a simple means to achieve a wide range of thin and ergonomically pleasing options for the consumer. The invention provides benefits of flexibility in choosing a host of materials to meet the needs of a specific manufacturing objective and rapidly moving towards the next step in the manufacture of semiconductors and flat panel displays.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.