Constrained cure component attach process for improved IC package warpage control
US10290569B2 · kind B2 · utility
1Cited by
0References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2017 |
| Grant date | May 14, 2019 |
| Priority date | — |
| Expiry date | Sep 29, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus, comprising a first platform comprising a first working surface having a first non-planar portion; and a second platform comprising a second working surface having a second non-planar portion, wherein: the second working surface is opposite the first working surface, a distance between the first working surface and the second working surface is adjustable, the first non-planar portion comprises a first curved portion, and the second non-planar portion comprises a second curved portion opposite the first curved portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.