Method for determining the parameters of an IC manufacturing process model
US10295912B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2015 |
| Grant date | May 21, 2019 |
| Priority date | — |
| Expiry date | Sep 1, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/31796
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An IC manufacturing model is disclosed, wherein input variables and an output variable are measured using a calibration set of patterns. The model can or cannot include a PSF. The output variable may be a dimensional bias between printed patterns and target patterns or simulated patterns. It can also be a Threshold To Meet Experiments. The input variables may be defined by a metric which uses kernel functions, preferably with a deformation function which includes a shift angle and a convolution procedure. A functional or associative relationship between the input variables and the output variable is defined. Preferably this definition includes normalization steps and interpolation steps. Advantageously, the interpolation step is of the kriging type. The invention achieves a much more accurate modeling of IC manufacturing, simulation or inspection processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.