Method of forming a wrap-around contact on a semiconductor device
US10297499B2 · kind B2 · utility
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2References
15Claims
0Family size
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Key dates
| Filing date | Jul 6, 2017 |
| Grant date | May 21, 2019 |
| Priority date | — |
| Expiry date | Jul 6, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/6219
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Techniques and methods related to forming a wrap-around contact on a semiconductor device, and apparatus, system, and mobile platform incorporating such semiconductor devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.