Direct selective adhesion promotor plating

US10297536B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Jochen Dangelmaier · Beratzhausen, DE
• Kim Huat Hoa · Melaka City, MY
• Hazrul Alang Abd Hamid · Kuala Pilah, MY
• Andreas Allmeier · Pfatter, DE
• Dietmar Lang · Regenstauf, DE

Key dates

• Filing date: May 25, 2017
• Grant date: May 21, 2019
• Expiry date: May 25, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/00014
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A lead frame strip having a plurality of unit lead frames is provided. Each of the unit lead frames have a die paddle and a plurality of leads extending away from the die paddle. A first one of the unit lead frames is plated with an adhesion promoter plating material within a package outline area of the first unit lead frame. The package outline area includes one of the die paddles and interior portions of the leads. Wire bond sites are processed in the first unit lead frame before or after the plating of the first lead frame such that, after the plating of the first lead frame. The wire bond sites are substantially devoid of the adhesion promoter plating material. The wire bond sites are disposed within the package outline area at an end of the interior portions of the leads that is closest to the die paddle.