Electronic device including soldered surface-mount component
US10297539B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 28, 2015 |
| Grant date | May 21, 2019 |
| Priority date | — |
| Expiry date | Jul 27, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/047
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The melting of die-bonding solder material is prevented even when soldering a surface-mount component formed using the die-bonding solder material on a printed circuit board using a mounting solder material. The surface-mount component formed using (Sn—Sb)-based solder material having high melting point as the solder material for die pad, the (Sn—Sb)-based solder material containing Cu not more than a predetermined quantity of Cu constituent and a main ingredient thereof being Sn, is soldered on a board terminal portion of a circuit board using (Sn—Ag—Cu—Bi)-based solder material as the mounting solder material with the solder material being applied on the terminal portion. The melting of die-bonding solder material is prevented even at the heating temperature (240 degrees C. or less) of a reflow furnace.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.