Thermocompression bonding using plasma gas
US10297567B2 · kind B2 · utility
1Cited by
2References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2015 |
| Grant date | May 21, 2019 |
| Priority date | — |
| Expiry date | Dec 18, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01054
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Described herein are devices and techniques for thermocompression bonding. A device can include a housing, a platform, and a plasma jet. The housing can define a chamber. The platform can be located within the chamber and can be proximate a thermocompression chip bonder. The plasma jet can be located proximate the platform. The plasma jet can be movable about the platform. The plasma jet can include a nozzle arranged to direct a plasma gas onto the platform. Also described are other embodiments for thermocompression bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.