Amrita Mallik
2Patents
1h-index
12Co-inventors
31Inventor score
Filing activity: Jun 17, 2015 → Dec 18, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10297567B2 | Thermocompression bonding using plasma gas | Electricity | 1 | Active |
| US10475715B2 | Two material high K thermal encapsulant system | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.