Polymer resin composition, polyimide resin film, preparation method of polyimide resin film, flexible metal laminate, and circuit board
US10299378B2 · kind B2 · utility
2Cited by
2References
29Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 28, 2012 |
| Grant date | May 21, 2019 |
| Priority date | — |
| Expiry date | Jul 14, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention is related to a polymer resin composition capable of providing an insulating material having a low dielectric constant and excellent mechanical properties, a polyimide resin film obtained by using the polymer resin composition, a preparation method of a polyimide resin film, and a circuit board and a metal laminate including the polyimide resin film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.