Modular thermal solution for high-performance processors
US10299403B2 · kind B2 · utility
2Cited by
22References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2015 |
| Grant date | May 21, 2019 |
| Priority date | — |
| Expiry date | Nov 24, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20172
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Various modular thermal management systems for a computing device and methods of using the same are disclosed. In one aspect, a method of providing thermal management for a heat generating component is provided. The method includes placing a heat sink in thermal contact with the heat generating component and coupling a shroud to the heat sink. The shroud has a first opening to direct air in a first direction past the heat sink and a second opening to direct air in a second direction past the heat sink. Air is moved through the first opening or the second opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.