Patent · US Active

Optical interconnect attach to photonic device with partitioning adhesive function

US10302869B1 · kind B1 · utility

0Cited by
8References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 27, 2018
Grant dateMay 28, 2019
Priority date—
Expiry dateSep 27, 2038

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG02B6/3636
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

A photonic assembly includes an optical die including a suspended membrane structure arranged thereon. A cavity is arranged beneath the suspended membrane structure. An optical interconnect structure is arranged on the optical die. The photonic assembly also includes an optical adhesive arranged on the optical die in contact with the optical interconnect structure. The optical adhesive is arranged beneath the suspended membrane structure to at least partially fill the cavity beneath the suspended membrane structure. The photonic assembly also includes a structural adhesive arranged on the optical die adjacent to the optical adhesive.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.