Nicolas Boyer
11Patents
2h-index
17Co-inventors
43Inventor score
Filing activity: Apr 22, 2011 → Sep 27, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9568682B1 | Component and chip assembly structure for high yield parallelized fiber assembly | Physics | 8 | Active |
| US10295749B1 | Optical interconnect attach to photonic device with partitioning adhesive function | Physics | 7 | Active |
| US9656420B2 | Bondline control fixture and method of affixing first and second components | Physics | 2 | Active |
| US9651747B1 | Fiber pigtail assembly with integrated lid enabling optical fiber mobility | Physics | 2 | Active |
| US9662830B2 | Bondline control fixture and method of affixing first and second components | Physics | 2 | Active |
| US10338325B1 | Nanofiller in an optical interface | Physics | 1 | Active |
| US9810864B2 | Fiber pigtail assembly with integrated lid enabling optical fiber mobility | Physics | 1 | Active |
| US9338935B2 | System for removing an electronic component from a substrate | Emerging Cross-Sectional Technologies | 1 | Active |
| US9684133B2 | Component assembly apparatus | Physics | 0 | Active |
| US10302869B1 | Optical interconnect attach to photonic device with partitioning adhesive function | Physics | 0 | Active |
| US8925170B2 | Method for removing an electronic component from a substrate | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.