Electronic component module having a protective film comprising a protective layer and a low reflectivity layer having a rough outer surface and manufacturing method thereof
US10304779B2 · kind B2 · utility
0Cited by
1References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2017 |
| Grant date | May 28, 2019 |
| Priority date | — |
| Expiry date | Nov 11, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is an electronic component module that includes, an electronic component, a mold resin that seals the electronic component, a conductive film that covers the mold resin, and a protective film that covers the conductive film. The protective film includes a protective layer and a low reflective layer, and the low reflective layer is free from contacting the conductive film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.