Using materials to increase structural rigidity, decrease size, improve safety, enhance thermal performance and speed charging in small form factor devices
US10305529B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 26, 2013 |
| Grant date | May 28, 2019 |
| Priority date | — |
| Expiry date | Dec 26, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1327
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Systems and methods may provide for a device including a housing, one or more electronic components positioned within the housing, and a first cured resin composition positioned within the housing, the first cured resin composition including a thermal energy storage material and a first filler material. The device may also include a second cured resin composition positioned within the housing, the second cured resin composition including the thermal energy storage material and a second filler material. The first filler material and the second filler material may be different, wherein the first cured resin composition and the second cured resin composition may encompass at least one of the one or more electronic components. In other examples, the electronic components include a power supply and the device complies with an ATEX equipment directive for explosive atmospheres. Moreover, component underfill and/or assembly overmold processes may be used to fabricate the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.