Kevin Byrd
4Patents
1h-index
16Co-inventors
37Inventor score
Filing activity: Dec 26, 2013 → Dec 7, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10548249B2 | Shielding in electronic assemblies | Electricity | 8 | Active |
| US10701796B2 | Electromagnetic interference (EMI) shield | Electricity | 1 | Active |
| US12341121B2 | Through-substrate underfill formation for an integrated circuit assembly | Electricity | 0 | Active |
| US10305529B2 | Using materials to increase structural rigidity, decrease size, improve safety, enhance thermal performance and speed charging in small form factor devices | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.