Patent · US Active

Cooling trough, cooler and power module assembly

US10306800B2 · kind B2 · utility

1Cited by

3References

17Claims

0Family size

Assignee

DANFOSS SILICON POWER GMBH · DE

Inventors

Franke Wulf-Toke · Harrislee, DE
Ronald Eisele · Surendorf, DE
Reiner Hinken · Nortorf, DE
Frank Osterwald · Kiel, DE
Klaus Olesen · Skanderborg, DK
Lars Paulsen · Hollingstedt, DE

Key dates

Filing date	Nov 19, 2015
Grant date	May 28, 2019
Priority date	—
Expiry date	Nov 19, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The present invention discloses a cooling trough comprising an unflat surface, surrounding an opening of the cooling trough, configured with a height essentially decreasing inwardly. At least one supporting line, running around the opening of the cooling trough, is formed on the unflat surface. The at least one supporting line contacts a baseplate of a power module after the baseplate is attached to the unflat surface of the cooling trough. In addition, the present invention also discloses a cooler comprising the cooling trough and a power module assembly comprising the cooler.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.