Inventor · Surendorf, DE

Ronald Eisele

34Patents
4h-index
17Co-inventors
60Inventor score

Filing activity: Apr 4, 1991 → Dec 18, 2020

Most-cited inventions

PatentTitleAreaCited byStatus
US5159834A Device for optoelectronic interface measurement and refractometry in liquids Physics 28 Expired
US7339788B2 Cooling unit and flow distributing element for use in such unit Electricity 18 Expired
US9040338B2 Power semiconductor module with method for manufacturing a sintered power semiconductor module Electricity 9 Active
US6119497A Method for use with a lathe for forming a journal on metal stock Performing Operations; Transporting 4 Expired
US7040381B2 Cooling device Electricity 4 Expired
US8017446B2 Method for manufacturing a rigid power module suited for high-voltage applications Electricity 3 Active
US10483229B2 Sintering device Electricity 2 Active
US10832995B2 Power module Electricity 2 Active
US10685894B2 Semi-conductor module with an encapsulating cement mass that covers a semi-conductor component Electricity 2 Active
US7529091B2 Power semiconductor module and method for cooling a power semiconductor module Electricity 2 Expired
US11400514B2 Sintering tool and method for sintering an electronic subassembly Electricity 2 Active
US10593608B2 Semiconductor module comprising an encapsulating compound that covers at least one semiconductor component Electricity 2 Active
US8490681B2 Fluid cooling system Electricity 1 Active
US10381283B2 Power semiconductor module Electricity 1 Active
US9786627B2 Method for creating a connection between metallic moulded bodies and a power semiconductor which is used to bond to thick wires or strips Emerging Cross-Sectional Technologies 1 Active
US9613929B2 Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof Electricity 1 Active
US10306800B2 Cooling trough, cooler and power module assembly Electricity 1 Active
US10438924B2 Method for cohesively connecting a first component of a power semiconductor module to a second component of a power semiconductor module Electricity 0 Active
US11626383B2 Process and device for low-temperature pressure sintering Electricity 0 Active
US12125817B2 Semiconductor module with a first substrate, a second substrate and a spacer separating the substrates from each other Electricity 0 Active
US10403566B2 Power module Electricity 0 Active
US8802564B2 Method of manufacturing a semiconductor component Electricity 0 Active
US11776932B2 Process and device for low-temperature pressure sintering Electricity 0 Active
US9287232B2 Method for producing a high-temperature and temperature-change resistant connection between a semiconductor module and a connection partner Electricity 0 Active
US12136585B2 Compact power electronics module with increased cooling surface Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.