Anisotropy reduction in coating of conductive films
US10307786B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2016 |
| Grant date | Jun 4, 2019 |
| Priority date | — |
| Expiry date | Feb 14, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/25
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided herein is a method of forming a conductive film, the method comprising: providing a coating solution having a plurality of conductive nanostructures and a fluid carrier; moving a web in a machine direction; forming a wet film by depositing the coating solution on the moving web, wherein the wet film has a first dimension extending parallel to the machine direction and a second dimension transverse to the machine direction; applying an air flow across the wet film along the second dimension, whereby at least some of the conductive nanostructures in the wet film are reoriented; and allowing the wet film to dry to provide the conductive film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.