Metal powder, ink, sintered body, substrate for printed circuit board, and method for manufacturing metal powder
US10307825B2 · kind B2 · utility
0Cited by
2References
6Claims
0Family size
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Key dates
| Filing date | Jan 26, 2016 |
| Grant date | Jun 4, 2019 |
| Priority date | — |
| Expiry date | Jan 26, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22C9/00
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An object of the present invention is to provide a metal powder and an ink with which a sintered body having good flexibility can be formed, and a sintered body having good flexibility. A metal powder according to an embodiment of the present invention has a mean particle size D50BET of 1 nm or more and 200 nm or less as calculated by a BET method, a mean crystallite size DCryst of 20 nm or less as determined by an X-ray analysis, and a ratio (DCryst/D50BET) of the mean crystallite size DCryst to the mean particle size D50BET of less than 0.4.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.